1 / 3 BM801M specifications are subject to change without notice. customers should verify actual device pe rformance in their specific applications www.bencent.com.cn order code: BM801M gas discharge tube version: a1 2016-07-11 ` size design 8.38.36mm high current handling capability 20,000a @ 8/20 s low capacitance and insertion loss fast response and long service life reliable to protect electrostatic surge moisture sensitivity level level 1 electrical parameter ac power schematic symbol application information package (top view) features exterior 1 2 1 2 agency approvals dc breakdown voltage 1 2 100v/s 640-960 v impulse spark-over voltage at 1kv/ s for 99 % of measured values ? 1200 v at 1kv/ s typical values of distribution ? 1150 v impulse discharge current 3 8/20 s 5times 20,000 a arc voltage at 1a ~15 v insulation resistance dc=100v 1 g ? capacitance at 1 mhz v dc =0.5v 1.5 pf weight ~1.75 g operating and storage temperature -40-90 marking without smd 1) at delivery aql 0.65 level ii iso 2859 2) in ionized mode 3) terms and current waveforms in accordance with itu-t rec. k. 12; iec 61643-21 icon description compliance with 2011/65/eu compliance with iec61249-2-21:2003 mean lead free compliance with ul1449, certificated e337906
2 / 3 BM801M specifications are subject to change without notice. customers should verify actual device pe rformance in their specific applications www.bencent.com.cn order code: BM801M gas discharge tube version: a1 2016-07-11 bm 801 m (1) (2) 3 (1) bencent smd gas discharge tube with 8.38.36 (lwh) (mm) dimension (2) dc breakdown voltage, e.g., 091=910 1 =90v (3) tolerance is dc breakdown voltage, m=20%, n=30% part numbering system recommended soldering pad product dimensions environmental reliability characteristics lead material copper body material ceramics ter minal finish 100% matte-tin plated product characteristics testing items technical standards high temperature storage test temperature: 90 time:2h low temperature storage test temperature: -40 time:2h vibration frequency 10-500hz amplitude 0.15mm time 45mi n s resistance of soldering heat temperature: 2605 time of dip soldering 10s 1time ref mm inch a 9.30.1 0.3660.004 b 4.20.1 0.1650.004 c 8.30.2 0.3270.008 d 8.30.2 0.3270.008 e 0.50.05 0.020.002 f 60.2 0.2360.008 ref mm inch a 7.95 0.313 b 4.5 0.177 c 8 0.315 note: up-screen program can be specified by cust omers request via contacting bencent service solderability test solderability solder pot temperature: 245 5 solder dwell time: 4-6 seconds
3 / 3 BM801M specifications are subject to change without notice. customers should verify actual device pe rformance in their specific applications www.bencent.com.cn order code: BM801M gas discharge tube version: a1 2016-07-11 ref mm inch p0 4.00.1 0.157 0.004 d0 1.5 0.1 0.059 +0.004 p1 120.1 0.472 0.004 p2 2.00.1 0.079 0.004 a 6.5 0.2 0.256 0.008 b 8.4 0.2 0.331 0.008 f 7.50.1 0.295 0.004 e 1.750.1 0.069 0.004 w 160.3 0.63 0.012 d 3302 12.99 0.079 d1 100 2 3.94 0.079 d2 13 0.15 0.512 0 .006 w1 212 0.8270.079 -0 -0 package reel information reflow profile outline reel (pcs) inside carton (pcs) per carton (pcs) carton size(mm) l w h taping 500 1000 8000 360 360 380 reflow condition pb-free assembly pre heat temperature min 150c temperature max 200c time min to max 60 C 180 secs average ramp up rate liquids tamp t l to peal 3c/second max t s (max) to t l - ramp-up rate 3c/second max reflow - temperature (t l ) (liquids) 217c - temperature (t l ) 60 C 150 seconds peak temperature (t p ) 260+0/-5 c time within 5c of actual peak temperature (t p ) 20 C 40 seconds ramp-down rate 6c/second max time 25c to peak temperature (t p ) 8 minutes max. do not exceed 260c t p ramp-down t p t l t s(max) t s(min) 25 time to peak temper ature time temperature critical zone t l to t p t l preheat ramp-up t s
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